AB Mikroelektronik battery switch enables fast, safe and noiseless disconnection with high-performance electric vehicle batteries.
E-mobility is changing the future of transport. This technology change is a global trend, and between 2020 and 2030 should become a reality for a broad base of consumers. For several years now, hybridization of vehicles has been rolling out across the fleets of many car manufacturers, and continued progress is expected.
AB Mikroelektronik´s innovative packaging technologies offer high performance for power semiconductor modules
One of the keystone technologies in this transition is the dynamic field of power electronics. Assembling and packaging power semiconductors in a highly efficient way, both for lowest power dissipation and highest heat conduction, provides the route to increased range, faster charging and many other advantages. AB Mikroelektronik has transformed these demanding requirements into an optimized packaging concept, and today offers customer-specific solutions for even the smallest installation spaces and the highest thermal requirements.
AB Mikroelektronik´s battery switch achieves high power density in a small package volume
Among these newly developed technologies is a powerful switch that disconnects the battery of an electric car from the power train in a fast, safe and noiseless way. Bare die semiconductors are directly attached to rigid aluminium metal substrates, produced using thick film technology. Both isolating and conductive electrical tracks can be applied in a flexible way on the substrates. The switch is located directly between the battery positive terminal and the load, and controls current flow in both directions.
All-aluminium power module for efficient and reliable connection to high current busbar systems
Parallel connection of multiple power semiconductors means higher currents can be supported, with power dissipation shared between them. Typical on-state resistance of the complete power module is as low as 0.75 mOhm at 25 °C. Very low thermal resistance of the module of only 0.2 K/W from semiconductor junction to water is achieved by applying materials with a high thermal conductivity. This property is mainly achieved by the pure aluminium metal substrate on which bare die semiconductors are directly attached. For transient current pulses, the thermal resistance is less than 0.1 K/W, which allows rapid power dissipation of about one kilowatt. For protection against humidity, and increased electrical isolation and ruggedness, the complete module is packaged in an epoxy compound with additional integrated sensors for temperature, voltage and current sensing.
The high efficiency of this module assures a cost effective design and minimum power consumption in typical e-mobility applications.
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